PLL Module Measurement Set-Up
PLL Module Application Circuit
Reflow Soldering Profile
NO
ITEM
Temperature (℃)
Time (sec)
1
Pre-heat
D1 : 140 ∼ D2 :160
T1 : 60±20
2
Soldering
D3 : 200
T2 : 20 ∼ 30
3
Peak Time
D4 : 230±10
T3 : 7 max
Soldering Iron Condition
Cleaning Condition
(1) Temperature : 330℃ max(2) Duration : 4 sec max (1 part)(3) Capacity : 30W max
(1) Solvent : I.P.A(2) Method - Temperature - Duration Permeation : 40℃ max 5min max or Vapor : 90℃ max 2min max
